Title :
Quality Standardization for Polydimethysiloxane-Based Optical Interconnect Production From Optical Aspects
Author :
Cai, Dengke ; Neyer, Andreas
Author_Institution :
Fak. fur Elektrotechnik und Informationstechnik, Tech. Univ. Dortmund, Dortmund, Germany
fDate :
7/1/2010 12:00:00 AM
Abstract :
The influences of waveguide materials, fabrication conditions, and packaging substrates on the optical waveguide properties of electrical-optical circuit boards have been investigated by systematic variation of these conditions. Pt catalyst in polydimethysiloxane, casting mould sidewall roughness, interlay thickness, and packaging substrates show sensitive impact on optical waveguide insertion loss and in terms of defined target of optical loss, the basic quality criteria can be defined before production.
Keywords :
casting; optical fabrication; optical interconnections; optical losses; optical polymers; optical waveguides; packaging; standardisation; casting mould; catalyst; electrical-optical circuit boards; interlay thickness; optical interconnect; optical waveguide insertion loss; packaging substrates; polydimethysiloxane; sidewall roughness; Optical interconnect; polydimethysiloxane (PDMS); production; quality standardization;
Journal_Title :
Photonics Technology Letters, IEEE
DOI :
10.1109/LPT.2010.2049010