Title :
Fast Transient Analysis of Next-Generation Interconnects Based on Carbon Nanotubes
Author :
D´Amore, Marcello ; Sarto, Maria Sabrina ; Tamburrano, Alessio
Author_Institution :
Dept. of Electr. Eng., Sapienza Univ., Rome, Italy
fDate :
5/1/2010 12:00:00 AM
Abstract :
The scaling of copper wires and the increase in signal switching speed produce transient crosstalk coupling between interconnect lines, which causes overshoots and additional time delay. The time-domain analysis of CMOS gates driving next-generation interconnects consisting of single wall carbon nanotube (SWCNT) bundles or multiwall carbon nanotubes (MWCNTs) is carried out. Accurate simulation models of SWCNT bundles and MWCNTs are proposed in the frequency domain by using both the multiconductor transmission line (MTL) formulation and the multiequivalent single conductor (MESC) approach. The fast transient voltage responses of two coupled nanointerconnects of 14 and 22 nm technologies to a pulsed input are computed by means of both the MTL and the MESC models. The obtained results are in good agreement. The same agreement is achieved by computing the 50% time delay of the output voltages.
Keywords :
CMOS integrated circuits; carbon nanotubes; crosstalk; delays; integrated circuit interconnections; multiconductor transmission lines; time-domain analysis; transient analysis; transient response; CMOS gates driving next-generation interconnect line; copper wires; coupled nanointerconnects; fast transient analysis; multiconductor transmission line formulation; multiequivalent single conductor approach; multiwall carbon nanotubes; signal switching; simulation models; single wall carbon nanotube bundles; size 14 nm; size 22 nm; time delay; time-domain analysis; transient crosstalk coupling; transient voltage responses; Carbon nanotubes; Computational modeling; Copper; Crosstalk; Delay effects; Power system transients; Time domain analysis; Transient analysis; Voltage; Wires; Carbon nanotube (CNT); crosstalk; fast transient; interconnect; time delay;
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
DOI :
10.1109/TEMC.2010.2045383