DocumentCode :
148695
Title :
Welcome to ICEP 2014
Author :
Ishizuka, Masaru
Author_Institution :
Toyama Prefectural University, Japan
fYear :
2014
fDate :
23-25 April 2014
Firstpage :
1
Lastpage :
1
Abstract :
We welcome you to the International Conference on Electronics Packaging (ICEP) 2014, the largest and premier international conference on electronics packaging in Japan, to be held from April 23rd to 25th at the Toyama International Conference Center in Toyama, Japan.
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging (ICEP), 2014 International Conference on
Conference_Location :
Toyama, Japan
Print_ISBN :
978-4-904090-10-7
Type :
conf
DOI :
10.1109/ICEP.2014.6826645
Filename :
6826645
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=148695
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