Title :
Table of contents
Abstract :
The following topics are dealt with: automotive electronics; semiconductor materials; advanced packaging; substrates and interposers; thermal management; 3D IC packaging; DMR; printed electronics; power devices; medical devices; N-MEMS; interconnection; and optoelectronics.
Keywords :
automotive electronics; biomedical electronics; integrated circuit packaging; interconnections; micromechanical devices; nanoelectromechanical devices; optoelectronic devices; power semiconductor devices; semiconductor materials; substrates; thermal management (packaging); three-dimensional integrated circuits; 3D IC packaging; DMR; N-MEMS; advanced packaging; automotive electronics; interconnection; interposers; medical devices; optoelectronics; power devices; printed electronics; semiconductor materials; substrates; thermal management;
Conference_Titel :
Electronics Packaging (ICEP), 2014 International Conference on
Conference_Location :
Toyama
Print_ISBN :
978-4-904090-10-7
DOI :
10.1109/ICEP.2014.6826646
