مرکز منطقه ای اطلاع رساني علوم و فناوري

DocumentCode :

148702

Title :

Partner organizations

fYear :

2014

fDate :

23-25 April 2014

Firstpage :

Lastpage :

Abstract :

The conference organizers greatly appreciate the support of the various corporate sponsors listed.

fLanguage :

English

Publisher :

ieee

Conference_Titel :

Electronics Packaging (ICEP), 2014 International Conference on

Conference_Location :

Toyama, Japan

Print_ISBN :

978-4-904090-10-7

Type :

conf

DOI :

10.1109/ICEP.2014.6826649

Filename :

6826649

Link To Document :