Title :
Greater Than the Sum of Its Parts
Author :
Yang, Ning ; Caloz, Christophe ; Wu, Ke
Author_Institution :
Ecole Polytech. de Montreal, Montreal, QC, Canada
fDate :
6/1/2010 12:00:00 AM
Abstract :
Most RF systems are based on a self-design approach, in which the components are con-ceived independently from one another, based on budget specifications and following a pre-assigned common 50-Ω impedance interface. This approach requires the design of separate components with their own shielding package, related size constraints, and 50-Ω terminals. When these components are then combined on the system assembling, they require many interconnecting matching and transition circuits.
Keywords :
microwave integrated circuits; system-in-package; system-on-chip; codesign; microwave components; passive circuits; system in package technology; system miniaturization; Bandwidth; Costs; Integrated circuit interconnections; Integrated circuit packaging; MMICs; Microwave integrated circuits; Monolithic integrated circuits; Mutual coupling; Power system interconnection; Radio frequency;
Journal_Title :
Microwave Magazine, IEEE
DOI :
10.1109/MMM.2010.936495
