• DocumentCode
    1487186
  • Title

    Device-level early floorplanning algorithms for RF circuits

  • Author

    Aktuna, Mehmet ; Rutenbar, Rob A. ; Carley, L. Richard

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
  • Volume
    18
  • Issue
    4
  • fYear
    1999
  • fDate
    4/1/1999 12:00:00 AM
  • Firstpage
    375
  • Lastpage
    388
  • Abstract
    High-frequency circuits are notoriously difficult to lay out because of the tight coupling between device-level placement and wiring. Given that successful electrical performance requires careful control of the lowest-level geometric features-wire bends, precise length, planarity, etc., we suggest a new layout strategy for these circuits: early floorplanning at the device level. This paper develops a floorplanner for radio-frequency circuits based on a genetic algorithm (GA) that supports fully simultaneous placement and routing. The GA evolves slicing-style floorplans comprising devices and planned areas for wire meanders. Each floorplan candidate is fully routed with a gridless, detailed maze-router which can dynamically resize the floorplan as necessary. Experimental results demonstrate the ability of this approach to successfully optimize for wire planarity, realize multiple constraints on net lengths or phases, and achieve reasonable area in modest CPU times
  • Keywords
    circuit layout CAD; genetic algorithms; integrated circuit layout; network routing; wiring; CPU times; RF circuits; detailed maze-router; device-level early floorplanning algorithms; device-level placement; fully simultaneous placement; genetic algorithm; layout strategy; multiple constraints; net lengths; planarity; precise length; slicing-style floorplans; wire bends; wire meanders; Central Processing Unit; Constraint optimization; Coupling circuits; Design automation; Genetic algorithms; Integrated circuit layout; Radio frequency; Routing; Wire; Wiring;
  • fLanguage
    English
  • Journal_Title
    Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0278-0070
  • Type

    jour

  • DOI
    10.1109/43.752922
  • Filename
    752922