Title :
Ultrathin 4-layer flexible printed circuits (FPC) fabricated by molecular bonding technology
Author :
Fong-Ru Lin ; Suzuki, Daisuke ; Happoya, Akihiko ; Miyawaki, Manabu ; Kamiyama, Kazuto ; Takii, Syuukichi ; Kudo, Takahiro ; Mori, Kazuo
Author_Institution :
Toshiba Co., Japan
Abstract :
We have developed the ultrathin 4-layer flexible printed circuits (FPCs) with the thickness of 135 um. This 135 um ultrathin 4-layer FPC is made by the molecular bonding technology, by which the electroless plating (metallizing) can be directly applied to polyimide (PI) by using molecular junction agents. In this study, we show the fabrication procedures, the mechanism of direct copper plating, and the reliability verification of the ultrathin 4-layer FPC prototype.
Keywords :
bonding processes; bonds (chemical); electroplating; flexible electronics; printed circuits; FPC; direct copper plating; electroless plating; molecular bonding technology; molecular junction agents; polyimide; size 135 mum; ultrathin 4-layer flexible printed circuits; Films; Heating; Lamination; Prototypes; Reliability; Resins; Resists; direct copper plating; flexible printed circuits; molecular bonding technology; polyimide;
Conference_Titel :
Electronics Packaging (ICEP), 2014 International Conference on
Conference_Location :
Toyama
Print_ISBN :
978-4-904090-10-7
DOI :
10.1109/ICEP.2014.6826658
