Ultrathin 4-layer flexible printed circuits (FPC) fabricated by molecular bonding technology

Author

Fong-Ru Lin ; Suzuki, Daisuke ; Happoya, Akihiko ; Miyawaki, Manabu ; Kamiyama, Kazuto ; Takii, Syuukichi ; Kudo, Takahiro ; Mori, Kazuo

Author_Institution

Toshiba Co., Japan

fYear

2014

fDate

23-25 April 2014

Firstpage

44

Lastpage

49

Abstract

We have developed the ultrathin 4-layer flexible printed circuits (FPCs) with the thickness of 135 um. This 135 um ultrathin 4-layer FPC is made by the molecular bonding technology, by which the electroless plating (metallizing) can be directly applied to polyimide (PI) by using molecular junction agents. In this study, we show the fabrication procedures, the mechanism of direct copper plating, and the reliability verification of the ultrathin 4-layer FPC prototype.

Keywords

bonding processes; bonds (chemical); electroplating; flexible electronics; printed circuits; FPC; direct copper plating; electroless plating; molecular bonding technology; molecular junction agents; polyimide; size 135 mum; ultrathin 4-layer flexible printed circuits; Films; Heating; Lamination; Prototypes; Reliability; Resins; Resists; direct copper plating; flexible printed circuits; molecular bonding technology; polyimide;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging (ICEP), 2014 International Conference on

Conference_Location

Toyama

Print_ISBN

978-4-904090-10-7

Type

conf

DOI

10.1109/ICEP.2014.6826658

Filename

6826658