DocumentCode
1487551
Title
HANBOOK FOR PREPARING ENGINEERING DOCUMENTS [SCHOCH´S REVIEW]
Author
Schoch, K.F.
Volume
12
Issue
6
fYear
1996
Firstpage
37
Keywords
Assembly; Book reviews; Composite materials; Electronics packaging; IEEE Press; Plasma applications; Plasma materials processing; Polymers; Production; Testing;
fLanguage
English
Journal_Title
Electrical Insulation Magazine, IEEE
Publisher
ieee
ISSN
0883-7554
Type
jour
DOI
10.1109/MEI.1996.546288
Filename
546288
Link To Document