DocumentCode :
148762
Title :
Phase transformations of alloyed and core-shell metallic nanoparticles for interconnect applications
Author :
Jenn-Ming Song
Author_Institution :
Dept. of Mater. Sci. & Eng., Nat. Chung Hsing Univ., Taichung, Taiwan
fYear :
2014
fDate :
23-25 April 2014
Firstpage :
140
Lastpage :
143
Abstract :
In this study, the phase evolution upon heating of thiol-protected NPs of gold, silver and their alloys with various Au/Ag ratios (3:1, 1:1, and 1:3), as well as the phase transitions and oxidation of copper and copper-silver core shell NPs, are monitored by synchrotron radiation XRD. The interactions between ligands and surface atoms of NPs, and their influence on the coalescence and related properties will be reported. The coalescence of thiol-protected AuAg alloy nanoparticle deposits strongly depends on the rivalry between the thermodynamic and kinetic factors, which are respectively due to alloying effect and the ligand/surface atom interactions. With respect to the Cu@Ag nanoparticles, the formation temperatures of both the CuO and Cu2O were higher than those of pure Cu nanoparticles with similar size by at least 150 °C, due to the protection by thin Ag shell. After being heated to 500°C, discrete Ag nano-nodules on unprotected CuO micron-particles could be observed.
Keywords :
X-ray diffraction; copper alloys; gold alloys; integrated circuit interconnections; nanoparticles; phase transformations; silver alloys; synchrotron radiation; Ag; Au; Cu2O; XRD; coalescence; copper oxidation; copper-silver core shell NPs; core-shell metallic nanoparticles; interconnect applications; kinetic factors; ligand-surface atom interactions; phase evolution; phase transformations; phase transitions; synchrotron radiation; temperature 500 C; thermodynamic factors; thiol-protected NPs; Absorption; Gold; Heating; Nanoparticles; Surface morphology; Surface treatment; coalescence; nanoparticles; oxidation; phase transformation; synchrotron radiation XRD;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging (ICEP), 2014 International Conference on
Conference_Location :
Toyama
Print_ISBN :
978-4-904090-10-7
Type :
conf
DOI :
10.1109/ICEP.2014.6826678
Filename :
6826678
Link To Document :
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