Ultrasonic bonding method for thin film capacitor module

Author

Hattori, Asobu ; Hatano, Hiroshi ; Ogawa, Hiroyo

Author_Institution

Noda Screen Co., Ltd., Komaki, Japan

fYear

2014

fDate

23-25 April 2014

Firstpage

181

Lastpage

187

Abstract

For closer positioning of capacitors to LSI, we have developed a process for lamination of thin film capacitors made of strontium titanate (SrTiO3, STO) onto organic substrates of 30μm thin. The thin film capacitors can be mounted on to surface of board at very low height, and we have fabricated glass interposer with these technologies. In this paper, our development work on fabrication process for thin film capacitors and glass interposers, together with measurement data on their effect for improvement of power supply fluctuation with actual LSI, are reported.

Keywords

copper; laminations; large scale integration; organic compounds; strontium compounds; substrates; thin film capacitors; ultrasonic bonding; Cu-SrTiO₃-Cu; LSI; fabrication process; glass interposer; lamination process; measurement data; organic substrates; power supply fluctuation; strontium titanate; thin film capacitor module; ultrasonic bonding method; Acoustics; Bonding; Capacitors; Fluctuations; Glass; Large scale integration; Substrates; Assembly Challenges and Solutions; Dielectrics; Novel Materials and Processing; Thin Films;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging (ICEP), 2014 International Conference on

Conference_Location

Toyama

Print_ISBN

978-4-904090-10-7

Type

conf

DOI

10.1109/ICEP.2014.6826685

Filename

6826685