Title :
Ultrasonic bonding method for thin film capacitor module
Author :
Hattori, Asobu ; Hatano, Hiroshi ; Ogawa, Hiroyo
Author_Institution :
Noda Screen Co., Ltd., Komaki, Japan
Abstract :
For closer positioning of capacitors to LSI, we have developed a process for lamination of thin film capacitors made of strontium titanate (SrTiO3, STO) onto organic substrates of 30μm thin. The thin film capacitors can be mounted on to surface of board at very low height, and we have fabricated glass interposer with these technologies. In this paper, our development work on fabrication process for thin film capacitors and glass interposers, together with measurement data on their effect for improvement of power supply fluctuation with actual LSI, are reported.
Keywords :
copper; laminations; large scale integration; organic compounds; strontium compounds; substrates; thin film capacitors; ultrasonic bonding; Cu-SrTiO3-Cu; LSI; fabrication process; glass interposer; lamination process; measurement data; organic substrates; power supply fluctuation; strontium titanate; thin film capacitor module; ultrasonic bonding method; Acoustics; Bonding; Capacitors; Fluctuations; Glass; Large scale integration; Substrates; Assembly Challenges and Solutions; Dielectrics; Novel Materials and Processing; Thin Films;
Conference_Titel :
Electronics Packaging (ICEP), 2014 International Conference on
Conference_Location :
Toyama
Print_ISBN :
978-4-904090-10-7
DOI :
10.1109/ICEP.2014.6826685
