Room temperature bonding method for polymer films by surface activated bonding method using Al intermediate layer

For a sealing of organic electro luminescence displays and lightings, it is required that polymer films are bonded at room temperature without organic adhesives. A new bonding technique called modified surface activated bonding (mSAB) was presented to meet the requirement. However, the bonding fails particularly when vacuum condition isn´t good (around 10^-5 Pa). To solve the problem, polymer films are tried to bond using metal intermediate layer instead of Si adhesion layer used in the previous study. As a result, unbonded areas are reduced by means of the mSAB using Al intermediate layer.