Study on an interconnect technology toward flexible printed electronics

A reliability of a new film-type connection is investigated and compared to a conventional anisotropic conducting adhesive technology, e.g., an anisotropic conductive film (ACF) joint by measuring the contact resistance through environmental tests and flexibility tests. A film-type connector which thickness less than 0.1 mm is composed of a base material such as polyimide, an adhesive layer which deforms elastically against pressure, and electrodes arranged on the adhesive layer. Results of the test show that the film-type connection has some advantages compared to the ACF joint in mildness of the connecting condition and the contact resistance stability.