Relationship between shrinkage and conductivity properties of cured isotropic conductive adhesives

The aim of the present study is to investigate the relationship between shrinkage and conductivity of cured isotropic conductive adhesives (ICAs). The conductive adhesive is composed of organic and inorganic components. The onset of conductivity in ICA is because of the percolating network of the filler in the organic binder. Generally, conductivity in ICAs proceeds via, a tunneling, hopping, or ion-participating mechanisms. The findings showed that samples featuring short inter-particle (filler) distances facilitated conductivity processes as opposed to those featuring long inter-particle (filler) distances. No clear correlation could be drawn between the coefficient and conductivity.