Plastic molded package technology for MEMS sensor evolution of MEMS sensor package

Consumer MEMS sensor market has created in 2004 and still growing rapidly. The “Consumerization wave” of MEMS sensor for consumer products has led the surprising evolution for various kinds of new applications on new electronic devices especially on mobile terminals and also the growth of MEMS sensor industry [1]. The package technology is one of the most important technology element for MEMS sensor and it has been supporting this evolution from the background. The plastic molded MEMS package technology called LGA package supported huge amount of MEMS sensor manufacturing with low cost and industrialization of new type of sensors. This technology is very simple and popular for long time but it is still applicable for higher integration of various MEMS sensors and for new type of sensors. This technology is still capability for further integrations, multiple stacked technology with MEMS mechanical chips realizes single package system with MEMS sensors and it will explore the new application world in near future.