Integrated vapor chamber heat spreader for high power processors

Metals cover with high thermal conductivity on the top of processors die which calls Integrated Heat Spreader (IHS), The function of this metal plate is for spreading the heat from small area or processors die to the larger area of its surface for the better heat dissipation, then transfer the heat to the various cooling components. In the current technology, the IHS mostly is made of solid copper plate. In high performance processors for super computer producing a power of over 300 Watts requires lower spreading thermal resistance of IHS, however this is limited by the thermal conductivity of copper metal. The average thermal spreading resistance between the processor die and the copper IHS is a significant ratio to overall thermal resistance. This paper presents a newly solution to improve the thermal spreading resistance between processor die and the IHS by using two phase micro channel vapor chamber. The structure of micro channel vapor chamber was designed to utilize the combination of high thermal conductivity in short distance and high speed of vapor spreading in longer distance.