DocumentCode :
148844
Title :
Progress and benchmarking of CMOS-device technologies
Author :
Wakabayashi, H.
Author_Institution :
Tokyo Inst. of Technol., Yokohama, Japan
fYear :
2014
fDate :
23-25 April 2014
Firstpage :
434
Lastpage :
437
Abstract :
Progress of advanced CMOS device technology is reviewed by benchmarking data. To achieve further performance gains, an enhancement of Weff/Wfootprint is highly required to realize using taller fins and vertically-stacked nano-wires.
Keywords :
CMOS integrated circuits; nanowires; CMOS-device technology; benchmarking data; performance gains; taller fins; vertically-stacked nanowires; Benchmark testing; CMOS integrated circuits; CMOS technology; Density measurement; Logic gates; Power system measurements; Very large scale integration; advanced CMOS device; stacked nano-wire; taller fin;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging (ICEP), 2014 International Conference on
Conference_Location :
Toyama
Print_ISBN :
978-4-904090-10-7
Type :
conf
DOI :
10.1109/ICEP.2014.6826721
Filename :
6826721
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=148844
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