DocumentCode :
148851
Title :
High-performance cooling system with multi-channel electro-osmotic flow pumps for high-power 3D-ICs
Author :
Kudo, Hiroyuki ; Yonekawa, T. ; Yoshimi, S. ; Oguri, Y. ; Tsukune, A. ; Kim, Yong Sin ; Kitada, H. ; Fjimoto, K. ; Kinefuchi, I. ; Matsumoto, Yuki ; Ohba, Tsuyoshi
Author_Institution :
MEMS Center, Dai Nippon Printing Co., Ltd., Kashiwa, Japan
fYear :
2014
fDate :
23-25 April 2014
Firstpage :
480
Lastpage :
483
Abstract :
A multi-channel electro-osmotic flow (EOF) implemented to the closed-channel cooling system (C3S) has been developed for thermal management of stacked chips (3D-ICs). The EOF pump, which was fabricated using MEMS technology, provided driving capabilities of fluid flow through the micro channel at the Pmax of 1 × 104 Pa and Qmax of 38 μl/min. Cooling capability as high as 140 W/cm2 was demonstrated for the first time.
Keywords :
cooling; electrophoresis; flow; micromechanical devices; osmosis; thermal management (packaging); three-dimensional integrated circuits; C3S; EOF pump; MEMS technology; closed channel cooling system; fluid flow; high power 3D IC; multichannel electroosmotic flow pumps; stacked chips; thermal management; Coolants; Fluids; Heating; Pumps; Silicon; Through-silicon vias; 3D-ICs; Cooling system; Electro-osmotic flow pump; Thermal management;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging (ICEP), 2014 International Conference on
Conference_Location :
Toyama
Print_ISBN :
978-4-904090-10-7
Type :
conf
DOI :
10.1109/ICEP.2014.6826725
Filename :
6826725
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=148851
بازگشت