DocumentCode :
148853
Title :
Locally shielded differential-paired lines with bend discontinuities for SI and EMI performances
Author :
Kayano, Yoshiki ; Ohkoshi, Masashi ; Watabe, Tadashi ; Inoue, H.
Author_Institution :
Dept. of Electr. & Electron. Eng., Akita Univ., Akita, Japan
fYear :
2014
fDate :
23-25 April 2014
Firstpage :
484
Lastpage :
489
Abstract :
To provide the basic considerations for EM radiation from practical asymmetrical differential-paired lines with bend routing, this paper newly attempts to propose locally shielded differential-paired lines for establishing SI performance and suppressing imbalance component and EMI generated by differential-paired lines with bend (turnoff point) discontinuities. The conductive plane is placed on discontinuity region asymmetrically. The concept of locally shielded layout is based on compensation of phase-difference due to the bend discontinuities, by using electric-coupling between signal trace and a conductive plane for the shield. The proposed method is suitable for implementing on PCB, without changing layout of the differential-paired lines. To compare the effect of the locally shielded paired-lines on CM component, the |Scd21|, which is defined as the conversion from DM to CM, are evaluated. The significant suppression effectiveness of |Scd21| in the case study is achieved below 1 GHz by locally shielded differential-paired lines. Consequently, the validity of the proposed locally shielded layout is demonstrated in the case study. It is demonstrated that the proposed locally shielded layout is suitable for improving the SI performance and suppressing the CM in the case study. This study has successfully reported the basic method for suppressing imbalance component of differential-paired lines with bend discontinuities.
Keywords :
electromagnetic interference; microstrip lines; printed circuits; CM component; EM radiation; EMI performances; PCB; SI performances; asymmetric discontinuity region; asymmetrical differential-paired lines; bend discontinuities; bend routing; conductive plane; electric-coupling; imbalance component suppression; locally shielded differential-paired lines; locally shielded layout; microstrip line; phase-difference compensation; signal integrity; signal trace; Electromagnetic interference; Frequency measurement; Frequency response; Layout; Routing; Scattering parameters; Silicon; Differential-paired lines; bend (turnoff point); electromagnetic interference; signal integrity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging (ICEP), 2014 International Conference on
Conference_Location :
Toyama
Print_ISBN :
978-4-904090-10-7
Type :
conf
DOI :
10.1109/ICEP.2014.6826726
Filename :
6826726
Link To Document :
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