Title :
Modeling of DC corona discharge along an electrically conductive flat plate with gas flow
Author :
Colver, Gerald M. ; El-Khabiry, Samir
Author_Institution :
Dept. of Mech. Eng., Iowa State Univ., Ames, IA, USA
Abstract :
The development of a corona discharge was evaluated numerically over a finite region of a semi-infinite flat plate having small (ohmic) surface conductivity with flowing gas. The model simulates a positive ion corona discharge (ionic wind) in the direction of gas flow generated by two parallel wires mounted flush with the surface of the plate. The deposition and removal of ions at the surface are permitted. Five coupled partial differential equations govern the gas phase model together with empirical equations for electrical discharge (Φ-I characteristic). Two voltage bias case studies were considered: first, the two electrodes have the same potential but are of opposite sign; and second, the positive electrode carries the full potential with the remaining electrode grounded. Several interesting effects are noted relating to the voltage and current distribution, surface potential, and free-stream velocity. Boundary layer development and surface shear are also discussed
Keywords :
corona; current distribution; electrodes; ionic conductivity; partial differential equations; plasma flow; plasma transport processes; surface conductivity; DC corona discharge modeling; boundary layer development; coupled partial differential equations; current distribution; electrical discharge; electrically conductive flat plate; flowing gas; flush mounted parallel wires; free-stream velocity; gas flow; gas phase model; grounded electrode; ionic wind; ions deposition; ions removal; ohmic surface conductivity; positive electrode; positive ion corona discharge; semi-infinite flat plate; surface potential; surface shear; voltage bias; voltage distribution; Conductivity; Corona; Current distribution; Differential equations; Electrodes; Fluid flow; Partial differential equations; Surface discharges; Voltage; Wires;
Journal_Title :
Industry Applications, IEEE Transactions on