Title :
Printed circuit board inspection using image analysis
Author :
Loh, Horng-Hai ; Lu, Ming-Sing
Author_Institution :
Dept. of Electr. Eng., Nat. Yunlin Univ. of Sci. & Technol., Taiwan, China
Abstract :
Computer vision has been widely used in the online inspection of electronic components. In this paper, the authors present a computer vision system using structured lighting, which provides them with an efficient solution for solder joint inspection. Their system uses a novel structured-lighting inspection technology to overcome some difficulties that traditional computer vision systems often experience. They developed a slant map surface shape estimation technique for the solder joint. From this technique, a solder joint can be determined to be a good (concave), bad (convex), bridged solder joint, or solder joint with surplus solder, or lacking solder
Keywords :
automatic optical inspection; computer vision; printed circuits; soldering; AOI; PCB; computer vision system; image analysis; printed circuit board inspection; slant map surface shape estimation technique; solder joint inspection; structured lighting; Computer vision; Image analysis; Industrial control; Inspection; Manufacturing industries; Manufacturing processes; Printed circuits; Shape; Soldering; Surface-mount technology;
Journal_Title :
Industry Applications, IEEE Transactions on
