DocumentCode :
148864
Title :
Reliability improvements in electronic systems by combining condition monitoring approaches
Author :
Jerchel, Kathleen ; Kruger, Max ; Middendorf, A. ; Nissen, Nils F. ; Lang, K.-D.
Author_Institution :
Fraunhofer Inst. for Reliability & Microintegration, Berlin, Germany
fYear :
2014
fDate :
23-25 April 2014
Firstpage :
511
Lastpage :
516
Abstract :
This paper gives an overview of different methods of condition monitoring (parameter measurement, canary principle, life cycle unit). It describes the advantage of combining the condition monitoring (CM) methods to improve the reliability of electronic systems. A workflow to implement CM methods is described as well as different system levels and the associated applicable CM method. The paper concludes with the example of an electronic system and a concept to monitor the whole system by means of all three CM methods.
Keywords :
condition monitoring; maintenance engineering; product life cycle management; reliability; canary principle; condition monitoring approaches; electronic systems; life cycle unit; parameter measurement; Assembly; Condition monitoring; Degradation; Failure analysis; Integrated circuit interconnections; Monitoring; Wires; Canary Device; Combining Approach; Condition Monitoring; Life Cycle Unit; Mission Profile; Parameter Measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging (ICEP), 2014 International Conference on
Conference_Location :
Toyama
Print_ISBN :
978-4-904090-10-7
Type :
conf
DOI :
10.1109/ICEP.2014.6826732
Filename :
6826732
Link To Document :
بازگشت