DocumentCode :
148895
Title :
Simulation based method to eliminate the effect of electrical transients from thermal transient measurements
Author :
Vass-Varnai, Andras ; Sarkany, Zoltan ; Szel, Attila ; Rencz, Marta
Author_Institution :
Mentor Graphics Corp., Budapest, Hungary
fYear :
2014
fDate :
23-25 April 2014
Firstpage :
591
Lastpage :
595
Abstract :
Thermal transient testing is the industry de-facto test method for the identification of junction temperatures and structural defects inside semiconductor devices. Unfortunately, at the beginning of the thermal transient curve in each case an electric effect can be observed, which appears immediately as the unit power step takes place. This electric effect covers the initial phase of thermal transient, and without knowing it the exact temperature of the device cannot be determined. The current industrial methods make a simple correction by cutting the first stage of the thermal measurement, but it is inaccurate, and the correction requires a manual step, therefore it is uncertain. This article describes a methodology to accurately reproduce the thermal transient curve eliminating the effect of the initial electric transients. We approached the problem by using the combination of thermal transient simulation and measurements, fitting the simulated results to the measured curve knowing that the second half of the measured curve certainly reflects the reality.
Keywords :
nondestructive testing; semiconductor device measurement; semiconductor device testing; temperature measurement; transient analysis; electrical transient effect elimination; industry de-facto test method; junction temperature identification; semiconductor devices; simulation based method; structural defects; thermal transient curve; thermal transient measurements; thermal transient simulation; thermal transient testing; unit power step; Electrical resistance measurement; Heating; Junctions; Numerical models; Semiconductor device measurement; Temperature measurement; Transient analysis; JEDEC JESD 51-14; Thermal transient testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging (ICEP), 2014 International Conference on
Conference_Location :
Toyama
Print_ISBN :
978-4-904090-10-7
Type :
conf
DOI :
10.1109/ICEP.2014.6826748
Filename :
6826748
Link To Document :
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