• DocumentCode
    1489220
  • Title

    Dynamic avalanche in 3.3-kV Si power diodes

  • Author

    Domeij, Martin ; Breitholtz, Bo ; Hillkirk, Leonardo Martin ; Linnros, Jan ; Östling, Mikael

  • Author_Institution
    Dept. of Electron., R. Inst. of Technol., Stockholm, Sweden
  • Volume
    46
  • Issue
    4
  • fYear
    1999
  • fDate
    4/1/1999 12:00:00 AM
  • Firstpage
    781
  • Lastpage
    786
  • Abstract
    Measurements of the safe reverse recovery limit were performed for 3.3-kV Si power diodes using a novel optical experimental technique. In this experiment, influence of the junction termination is effectively eliminated by optical generation of a laterally-localized carrier plasma. The turn-off failures observed in measurements at two temperatures showed no temperature dependence and could not be reproduced in ordinary one-dimensional (1-D) or two-dimensional (2-D) device simulations. To simulate the stability of the current density toward current filamentation, two 1-D diodes with an area ratio 1:19 and a 10% difference in initial carrier plasma level, were simulated in parallel. This resulted in a strongly inhomogeneous current distribution, and a rapid reverse voltage fall resembling the measured turn-off failures. Inhomogeneous current distribution in these simulations appears as the current decay ceases due to impact ionization, in qualitative agreement with a current instability condition proposed by Wachutka [1991]
  • Keywords
    current density; elemental semiconductors; failure analysis; impact ionisation; power semiconductor diodes; semiconductor device measurement; semiconductor plasma; silicon; 3.3 kV; Si; area ratio; current density; current filamentation; impact ionization; junction termination; laterally-localized carrier plasma; optical experimental technique; power diodes; rapid reverse voltage fall; safe reverse recovery limit; strongly inhomogeneous current distribution; turn-off failures; Current distribution; Diodes; Plasma density; Plasma devices; Plasma measurements; Plasma simulation; Plasma stability; Plasma temperature; Temperature dependence; Temperature measurement;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.753714
  • Filename
    753714