DocumentCode
148940
Title
Bond properties of silane modified optical adhesives for silicon photonics
Author
Mitachi, Seiko ; Hagiwara, Arisa ; Murata, Norio ; Kageyama, Hiroshi ; Kimura, K.
Author_Institution
Tokyo Univ. of Technol., Hachioji, Japan
fYear
2014
fDate
23-25 April 2014
Firstpage
712
Lastpage
715
Abstract
We report the adhesion properties between glass plates and silicon chips by measuring compression shear strength changes of silane modified optical adhesives, Y-41, Y-42, Y-43, and Y-45R after various reliability tests, with the goal to apply these adhesives to the newly emerging Si-photonics area.
Keywords
adhesion; adhesive bonding; compressive strength; elemental semiconductors; integrated optics; reliability; shear strength; silicon; Si; Y-41 adhesives; Y-42 adhesives; Y-43 adhesives; Y-45R adhesives; adhesion properties; bond properties; compression shear strength measurement; glass plates; reliability tests; silane modified optical adhesives; silicon chips; silicon photonics; Epoxy resins; Glass; Humidity; Integrated optics; Optical devices; Silicon; Temperature measurement; Si-photonics; compression shear strenth; optical adhesives; reliability test; silane modification;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging (ICEP), 2014 International Conference on
Conference_Location
Toyama
Print_ISBN
978-4-904090-10-7
Type
conf
DOI
10.1109/ICEP.2014.6826772
Filename
6826772
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