Title :
Bond properties of silane modified optical adhesives for silicon photonics
Author :
Mitachi, Seiko ; Hagiwara, Arisa ; Murata, Norio ; Kageyama, Hiroshi ; Kimura, K.
Author_Institution :
Tokyo Univ. of Technol., Hachioji, Japan
Abstract :
We report the adhesion properties between glass plates and silicon chips by measuring compression shear strength changes of silane modified optical adhesives, Y-41, Y-42, Y-43, and Y-45R after various reliability tests, with the goal to apply these adhesives to the newly emerging Si-photonics area.
Keywords :
adhesion; adhesive bonding; compressive strength; elemental semiconductors; integrated optics; reliability; shear strength; silicon; Si; Y-41 adhesives; Y-42 adhesives; Y-43 adhesives; Y-45R adhesives; adhesion properties; bond properties; compression shear strength measurement; glass plates; reliability tests; silane modified optical adhesives; silicon chips; silicon photonics; Epoxy resins; Glass; Humidity; Integrated optics; Optical devices; Silicon; Temperature measurement; Si-photonics; compression shear strenth; optical adhesives; reliability test; silane modification;
Conference_Titel :
Electronics Packaging (ICEP), 2014 International Conference on
Conference_Location :
Toyama
Print_ISBN :
978-4-904090-10-7
DOI :
10.1109/ICEP.2014.6826772
