• DocumentCode
    1489549
  • Title

    Enhanced Hole Transport in Short-Channel Strained-SiGe p-MOSFETs

  • Author

    Gomez, Leonardo ; Hashemi, Pouya ; HOyt, Judy L.

  • Author_Institution
    Microsyst. Technol. Labs., Massachusetts Inst. of Technol., Cambridge, MA, USA
  • Volume
    56
  • Issue
    11
  • fYear
    2009
  • Firstpage
    2644
  • Lastpage
    2651
  • Abstract
    Hole mobility and velocity are extracted from scaled strained-Si0.45Ge0.55 channel p-MOSFETs on insulator. Devices have been fabricated with sub-100-nm gate lengths, demonstrating hole mobility and velocity enhancements in strained- Si0.45Ge0.55 channel devices relative to Si. The effective hole mobility is extracted utilizing the dR/dL method. A hole mobility enhancement is observed relative to Si hole universal mobility for short-channel devices with gate lengths ranging from 65 to 150 nm. Hole velocities extracted using several different methods are compared. The hole velocity of strained-SiGe p-MOSFETs is enhanced over comparable Si control devices. The hole velocity enhancements extracted are on the order of 30%. Ballistic velocity simulations suggest that the addition of (110) uniaxial compressive strain to Si0.45Ge0.55 can result in a more substantial increase in velocity relative to relaxed Si.
  • Keywords
    MOSFET; silicon compounds; SiGe; ballistic velocity simulations; enhanced hole transport; hole mobility; short-channel devices; short-channel strained-SiGe p-MOSFET; CMOS technology; Compressive stress; Degradation; Germanium silicon alloys; Insulation; MOSFET circuits; Performance gain; Silicon germanium; Strain control; Uniaxial strain; Hole mobility; hole velocity; p-MOSFET; silicon germanium; uniaxial stress;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2009.2031043
  • Filename
    5272466