DocumentCode
1489549
Title
Enhanced Hole Transport in Short-Channel Strained-SiGe p-MOSFETs
Author
Gomez, Leonardo ; Hashemi, Pouya ; HOyt, Judy L.
Author_Institution
Microsyst. Technol. Labs., Massachusetts Inst. of Technol., Cambridge, MA, USA
Volume
56
Issue
11
fYear
2009
Firstpage
2644
Lastpage
2651
Abstract
Hole mobility and velocity are extracted from scaled strained-Si0.45Ge0.55 channel p-MOSFETs on insulator. Devices have been fabricated with sub-100-nm gate lengths, demonstrating hole mobility and velocity enhancements in strained- Si0.45Ge0.55 channel devices relative to Si. The effective hole mobility is extracted utilizing the dR/dL method. A hole mobility enhancement is observed relative to Si hole universal mobility for short-channel devices with gate lengths ranging from 65 to 150 nm. Hole velocities extracted using several different methods are compared. The hole velocity of strained-SiGe p-MOSFETs is enhanced over comparable Si control devices. The hole velocity enhancements extracted are on the order of 30%. Ballistic velocity simulations suggest that the addition of (110) uniaxial compressive strain to Si0.45Ge0.55 can result in a more substantial increase in velocity relative to relaxed Si.
Keywords
MOSFET; silicon compounds; SiGe; ballistic velocity simulations; enhanced hole transport; hole mobility; short-channel devices; short-channel strained-SiGe p-MOSFET; CMOS technology; Compressive stress; Degradation; Germanium silicon alloys; Insulation; MOSFET circuits; Performance gain; Silicon germanium; Strain control; Uniaxial strain; Hole mobility; hole velocity; p-MOSFET; silicon germanium; uniaxial stress;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2009.2031043
Filename
5272466
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