DocumentCode :
1490141
Title :
Silicon piezoresistive stress sensors and their application in electronic packaging
Author :
Suhling, Jeffrey C. ; Jaeger, Richard C.
Author_Institution :
Aurban University
Volume :
1
Issue :
1
fYear :
2001
fDate :
6/1/2001 12:00:00 AM
Firstpage :
14
Lastpage :
30
Keywords :
Circuit testing; Electronic packaging thermal management; Electronics packaging; Integrated circuit packaging; Lead; Piezoresistance; Semiconductor device packaging; Silicon; Temperature sensors; Thermal stresses;
fLanguage :
English
Journal_Title :
Sensors Journal, IEEE
Publisher :
ieee
ISSN :
1530-437X
Type :
jour
DOI :
10.1109/JSEN.2001.923584
Filename :
923584
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1490141
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