DocumentCode :
1490211
Title :
Electrical Characteristics of Germanium \\hbox {n}^{+}/ \\hbox {p} Junctions Obtained Using Rapid Thermal Annealing of Coimplanted P and Sb
Author :
Thareja, G. ; Cheng, S.-L. ; Kamins, T. ; Saraswat, K. ; Nishi, Y.
Author_Institution :
Dept. of Electr. Eng., Stanford Univ., Stanford, CA, USA
Volume :
32
Issue :
5
fYear :
2011
fDate :
5/1/2011 12:00:00 AM
Firstpage :
608
Lastpage :
610
Abstract :
Highly activated n-type dopant is essential for n+ /p germanium diodes which will be in use for source/drain regions in Ge n-MOSFETs as geometry scaling proceeds. Rapid thermal annealing of coimplanted P and Sb in Ge has provided n-type dopant activation beyond 1 × 1020 cm-3. However, there are limited reports on the electrical characteristics of these junctions. This letter has investigated the temperature-dependent diode I-V characteristics and contact resistance of metal-n+ Ge contacts. Well-behaved n+ /p Ge diodes (Ion/Ioff >; 105 and η <; 1.2) and significantly reduced contact resistance (ρc ~ 8 × 10-7 Ω · cm2) have been demonstrated.
Keywords :
MOSFET; annealing; antimony; contact resistance; germanium; phosphorus; Ge; P; Sb; electrical characteristics; geometry scaling; germanium junctions; rapid thermal annealing; reduced contact resistance; source-drain regions; temperature-dependent diode; Annealing; Contact resistance; Germanium; Junctions; Resistance; Silicon; Temperature measurement; Activation; antimony; contact resistance; germanium; junction; phosphorus;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2011.2119460
Filename :
5744094
Link To Document :
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