Title :
GaN Power Transistors on Si Substrates for Switching Applications
Author :
Ikeda, Nariaki ; Niiyama, Yuki ; Kambayashi, Hiroshi ; Sato, Yoshihiro ; Nomura, Takehiko ; Kato, Sadahiro ; Yoshida, Seikoh
Author_Institution :
Yokohama R&D Labs., Furukawa Electr. Co., Ltd., Yokohama, Japan
fDate :
7/1/2010 12:00:00 AM
Abstract :
In this paper, GaN power transistors on Si substrates for power switching application are reported. GaN heterojunction field-effect transistor (HFET) structure on Si is an important configuration in order to realize a low loss and high power devices as well as one of the cost-effective solutions. Current collapse phenomena are discussed for GaN-HFETs on Si substrate, resulting in suppression of the current collapse due to using the conducting Si substrate. Furthermore, attempts for normally off GaN-FETs were examined. A hybrid metal-oxide-semiconductor HFET structure is a promising candidate for obtaining devices with a lower on-resistance (Ron) and a high breakdown voltage (Vb).
Keywords :
gallium compounds; power HEMT; switching circuits; wide band gap semiconductors; GaN; GaN power transistors; GaN-HFET; Si; current collapse phenomena; heterojunction field-effect transistor structure; high breakdown voltage; high power devices; hybrid metal-oxide-semiconductor HFET structure; low loss devices; low on-resistance; power switching; Aluminum gallium nitride; Electron devices; FETs; Gallium nitride; HEMTs; Heterojunctions; MODFETs; Power transistors; Silicon carbide; Substrates; Current collapse; GaN power transistor; MOS-HFET; heterojunction field-effect transistor (HFET);
Journal_Title :
Proceedings of the IEEE
DOI :
10.1109/JPROC.2009.2034397