Title :
The location of very small particles in silane RF discharge
Author :
Rózsa, Károly ; Bánó, Gregor ; Gallagher, Alan
Author_Institution :
Joint Inst. for Lab. Astrophys., Colorado Univ., Boulder, CO, USA
fDate :
4/1/2001 12:00:00 AM
Abstract :
The size and location of silicon particles that grow in a pure silane, capacitively coupled RF discharge, are measured by laser light scattering. The discharge conditions were similar to those typically used to produce amorphous silicon devices, except the temperatures is 300 K. At early discharge time, when the particles are small (D~15 nm), they are located at the middle of the discharge. The larger ones that occur at later discharge times form a double layer nearer the electrodes. Surprisingly, the particles are not concentrated at the region of brightest discharge-light, which represents the distribution of high-energy electrons. Yet as expected, the distribution of film deposition on the electrodes fits radical diffusion with a source proportional to light intensity. It is also shown, by tilting the substrate, that a small gradient in plasma potential can have a major effect on particle positions
Keywords :
afterglows; dusty plasmas; electrodes; high-frequency discharges; light scattering; particle size measurement; plasma deposition; plasma diagnostics; plasma impurities; silicon compounds; substrates; 300 K; Si; Si particles; SiH4; amorphous Si devices; brightest discharge-light; capacitively coupled RF discharge; discharge conditions; discharge time; discharge times; double layer; electrodes; film deposition; high-energy electrons; laser light scattering; light intensity; particle location; particle positions; particle size; plasma potential; radical diffusion; silane RF discharge; small particles; substrate; substrate tilting; very small particles; Amorphous silicon; Electrodes; Fault location; Light scattering; Measurement by laser beam; Optical coupling; Particle measurements; Plasma temperature; Radio frequency; Size measurement;
Journal_Title :
Plasma Science, IEEE Transactions on