Title :
Heat dissipation within electrical switchgear enclosure
Author :
Bedkowski, M. ; Smolka, J. ; Ryfa, A. ; Bulinski, Zbigniew ; Nowak, A.J.
Author_Institution :
Inst. of Thermal Technol., Silesian Univ. of Technol., Gliwice, Poland
fDate :
March 31 2014-April 1 2014
Abstract :
In this paper, the coupled numerical model was used to study the heat dissipation rate within the switchgear enclosure. The main focus in the analysis was on the natural convection cooling. Thus the modification of inlets/outlets was proposed to increase the volume of flowing air. As a result of this study, the cooling capability of the unit was increased. Moreover, the reduction in the busbars temperature and changes in the air flow patterns were observed.
Keywords :
busbars; cooling; natural convection; packaging; air flow patterns; busbar temperature reduction; cooling capability; coupled numerical model; electrical switchgear enclosure; heat dissipation; natural convection cooling; air cooling; busbars; cooling optimisation; heat dissipation; switchgear;
Conference_Titel :
Computation in Electromagnetics (CEM 2014), 9th IET International Conference on
Conference_Location :
London
Electronic_ISBN :
978-1-84919-817-2
DOI :
10.1049/cp.2014.0219
