Title :
High-Fill-Factor Micromirror Array With Hidden Bimorph Actuators and Tip–Tilt-Piston Capability
Author :
Jia, Kemiao ; Samuelson, Sean R. ; Xie, Huikai
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Florida, Gainesville, FL, USA
fDate :
6/1/2011 12:00:00 AM
Abstract :
This paper presents the design, fabrication, packaging, and characterization of a novel high-fill-factor micromirror array (MMA) actuated by electrothermal bimorphs. In this paper, 4 × 4 MMA devices with an 88% area fill factor at normal incidence, 1.5 mm × 1.5 mm subaperture size, and single-crystal-silicon-supported mirror plates have been fabricated based on a single silicon-on-insulator wafer, without additional bonding/transfer processes. The bimorph actuators are hidden underneath the mirror plates, which are also protected by silicon walls. The MMA devices can directly be surface mounted onto driving circuit chips or printed circuit boards after fabrication. The subapertures can generate large tip-tilt-piston scanning and can individually be addressed. Static characterizations of the packaged devices show that each subaperture can achieve a piston stroke of ~310 μm and optical deflection angles greater than ±25° in both the x- and y-axes, all at 8-V dc. The preliminary laser-steering optical-phased-array capability of the obtained MMA device has also experimentally been demonstrated. This paper is based on the conference proceedings presented at the 23rd IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2010), Hong Kong.
Keywords :
micro-optomechanical devices; microactuators; micromirrors; printed circuits; silicon-on-insulator; area fill factor; circuit chips; electrothermal bimorphs; hidden bimorph actuators; high-fill-factor micromirror array; laser-steering optical-phased-array capability; optical deflection angles; piston stroke; printed circuit boards; silicon-on-insulator wafer; single-crystal-silicon-supported mirror plates; surface mounting; tip-tilt-piston capability; voltage 8 V; Actuators; Apertures; Micromirrors; Optical device fabrication; Silicon; Bimorph; flip-chip packaging; microelectromechanical systems (MEMS); micromirror; micromirror array (MMA); microoptoelectromechanical systems (MOEMS); optical phased array (OPA); surface mounting;
Journal_Title :
Microelectromechanical Systems, Journal of
DOI :
10.1109/JMEMS.2011.2127449