DocumentCode :
1491426
Title :
Key Aspects in Modeling of Thin Epi SOS Technology With Application of BSIMSOI
Author :
Roach, James ; Chen, Lee-Wen ; Clarke, Peter ; Dikshit, Amit ; Rotella, Francis M.
Author_Institution :
Peregrine Semicond., San Diego, CA, USA
Volume :
46
Issue :
5
fYear :
2011
fDate :
5/1/2011 12:00:00 AM
Firstpage :
1089
Lastpage :
1099
Abstract :
This work addresses the device modeling challenges of production-quality, state-of-the-art, silicon-on-sapphire (SOS) processes. Differences between SOS, silicon-on-insulator (SOI), and bulk CMOS are highlighted, with emphasis on the key differences in the modeling methodology. For RF and low-power applications, SOS has distinct advantages over SOI, such as reduced parasitics, better linearity, and enhanced electrical isolation. Yet little is reported in the literature about modeling of a commercially viable SOS process. Though originally developed for SOI, it is demonstrated that the BSIMSOI model can adequately represent SOS MOSFETs, including fully and partially depleted devices. For RF switch applications, RON and COFF are captured with reasonable accuracy. An additional RF figure of merit, fT, is also reasonably well modeled, yielding peak values in the 40-50 GHz range.
Keywords :
MOSFET; semiconductor device models; silicon-on-insulator; BSIMSOI model; CMOS; SOS MOSFET; device modeling; frequency 40 GHz to 50 GHz; silicon-on-insulator; thin epi silicon-on-sapphire technology; Capacitance; Logic gates; MOSFETs; Semiconductor device modeling; Silicon; Silicon on insulator technology; Substrates; BSIMSOI; RF devices; RF modeling; semiconductor device modeling; silicon-on-insulator (SOI) technology; silicon-on-sapphire (SOS);
fLanguage :
English
Journal_Title :
Solid-State Circuits, IEEE Journal of
Publisher :
ieee
ISSN :
0018-9200
Type :
jour
DOI :
10.1109/JSSC.2011.2118270
Filename :
5746541
Link To Document :
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