• DocumentCode
    1491426
  • Title

    Key Aspects in Modeling of Thin Epi SOS Technology With Application of BSIMSOI

  • Author

    Roach, James ; Chen, Lee-Wen ; Clarke, Peter ; Dikshit, Amit ; Rotella, Francis M.

  • Author_Institution
    Peregrine Semicond., San Diego, CA, USA
  • Volume
    46
  • Issue
    5
  • fYear
    2011
  • fDate
    5/1/2011 12:00:00 AM
  • Firstpage
    1089
  • Lastpage
    1099
  • Abstract
    This work addresses the device modeling challenges of production-quality, state-of-the-art, silicon-on-sapphire (SOS) processes. Differences between SOS, silicon-on-insulator (SOI), and bulk CMOS are highlighted, with emphasis on the key differences in the modeling methodology. For RF and low-power applications, SOS has distinct advantages over SOI, such as reduced parasitics, better linearity, and enhanced electrical isolation. Yet little is reported in the literature about modeling of a commercially viable SOS process. Though originally developed for SOI, it is demonstrated that the BSIMSOI model can adequately represent SOS MOSFETs, including fully and partially depleted devices. For RF switch applications, RON and COFF are captured with reasonable accuracy. An additional RF figure of merit, fT, is also reasonably well modeled, yielding peak values in the 40-50 GHz range.
  • Keywords
    MOSFET; semiconductor device models; silicon-on-insulator; BSIMSOI model; CMOS; SOS MOSFET; device modeling; frequency 40 GHz to 50 GHz; silicon-on-insulator; thin epi silicon-on-sapphire technology; Capacitance; Logic gates; MOSFETs; Semiconductor device modeling; Silicon; Silicon on insulator technology; Substrates; BSIMSOI; RF devices; RF modeling; semiconductor device modeling; silicon-on-insulator (SOI) technology; silicon-on-sapphire (SOS);
  • fLanguage
    English
  • Journal_Title
    Solid-State Circuits, IEEE Journal of
  • Publisher
    ieee
  • ISSN
    0018-9200
  • Type

    jour

  • DOI
    10.1109/JSSC.2011.2118270
  • Filename
    5746541