Stress in copper ion-exchanged glass waveguides

Author

Valles-Villarreal, N. ; Villalobos, A. ; Marquez, H.

Author_Institution

Div. de Fisica Aplicada, Centro de Investigacion Cientifica y de Educ. Superior de Ensenada, Mexico

Volume

17

Issue

4

fYear

1999

fDate

4/1/1999 12:00:00 AM

Firstpage

606

Lastpage

612

Abstract

This paper obtains stress profiles of copper ion-exchanged glass waveguides from the analysis of transverse electric (TE) and transverse magnetic (TM) modes which was measured by means of the prism-coupling technique. The reconstruction of stress profiles have been realized from an interpolation of the obtained data of effective refractive indexes. We found that the stress profiles decrease with the depth, in agreement with the behaviour of refractive index profiles. We also discuss the theory of the swelling of the glassy network, and we used an approximated model to fit our data of swelling versus diffusion time. The swelling measurements were done by means of a microinterferometrical technique

Keywords

copper; gradient index optics; ion exchange; light interferometry; nondestructive testing; optical fabrication; optical glass; optical planar waveguides; optical prisms; refractive index; stress measurement; Cu ion-exchanged glass waveguide stress; GRIN optical waveguides; TE mode analysis; TM mode analysis; copper ion-exchanged glass waveguides; diffusion time; effective refractive indexes; glassy network swelling; integrated optics; light interferometry; microinterferometrical technique; optical fabrication; prism-coupling technique; refractive index profiles; stress profile reconstruction; stress profiles; swelling measurements; Copper; Glass; Optical films; Optical planar waveguides; Optical refraction; Optical variables control; Optical waveguides; Planar waveguides; Refractive index; Stress;

fLanguage

English

Journal_Title

Lightwave Technology, Journal of

Publisher

ieee

ISSN

0733-8724

Type

jour

DOI

10.1109/50.754790

Filename

754790