DocumentCode :
1491840
Title :
Integrated facility layout and material handling system design in semiconductor fabrication facilities
Author :
Peters, Brett A. ; Yang, Taho
Author_Institution :
Dept. of Ind. Eng., Texas A&M Univ., College Station, TX, USA
Volume :
10
Issue :
3
fYear :
1997
fDate :
8/1/1997 12:00:00 AM
Firstpage :
360
Lastpage :
369
Abstract :
Semiconductor manufacturing is an important component of the U.S. manufacturing industry. Most of today´s fabrication facilities and those being designed for the near future use a bay layout configuration and an overhead monorail system for moving material between bays. These material handling systems are usually designed with a spine or perimeter type of configuration. This paper investigates the layout and material handling system design integration problem in semiconductor fabrication facilities and proposes a methodology for solving this integrated design problem. A spacefilling curve approach is used to address the facility layout, while the structure of the spine and perimeter configurations are exploited to create a network flow problem to determine the material handling system design. Computational results are presented and show exceptional promise for this procedure in solving the integrated design problem in a semiconductor manufacturing environment
Keywords :
computer aided facilities layout; computer integrated manufacturing; integrated circuit manufacture; materials handling; CIM; bay layout configuration; integrated design problem; integrated facility layout; material handling system design; overhead monorail system; perimeter configuration; semiconductor fabrication facilities; spacefilling curve approach; spine configuration; Computer aided manufacturing; Computer integrated manufacturing; Electronics industry; Fabrication; Manufacturing industries; Manufacturing processes; Materials handling; Production; Semiconductor device manufacture; Semiconductor materials;
fLanguage :
English
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
0894-6507
Type :
jour
DOI :
10.1109/66.618209
Filename :
618209
Link To Document :
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