• DocumentCode
    1491840
  • Title

    Integrated facility layout and material handling system design in semiconductor fabrication facilities

  • Author

    Peters, Brett A. ; Yang, Taho

  • Author_Institution
    Dept. of Ind. Eng., Texas A&M Univ., College Station, TX, USA
  • Volume
    10
  • Issue
    3
  • fYear
    1997
  • fDate
    8/1/1997 12:00:00 AM
  • Firstpage
    360
  • Lastpage
    369
  • Abstract
    Semiconductor manufacturing is an important component of the U.S. manufacturing industry. Most of today´s fabrication facilities and those being designed for the near future use a bay layout configuration and an overhead monorail system for moving material between bays. These material handling systems are usually designed with a spine or perimeter type of configuration. This paper investigates the layout and material handling system design integration problem in semiconductor fabrication facilities and proposes a methodology for solving this integrated design problem. A spacefilling curve approach is used to address the facility layout, while the structure of the spine and perimeter configurations are exploited to create a network flow problem to determine the material handling system design. Computational results are presented and show exceptional promise for this procedure in solving the integrated design problem in a semiconductor manufacturing environment
  • Keywords
    computer aided facilities layout; computer integrated manufacturing; integrated circuit manufacture; materials handling; CIM; bay layout configuration; integrated design problem; integrated facility layout; material handling system design; overhead monorail system; perimeter configuration; semiconductor fabrication facilities; spacefilling curve approach; spine configuration; Computer aided manufacturing; Computer integrated manufacturing; Electronics industry; Fabrication; Manufacturing industries; Manufacturing processes; Materials handling; Production; Semiconductor device manufacture; Semiconductor materials;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/66.618209
  • Filename
    618209