DocumentCode :
1491846
Title :
A test structure advisor and a coupled, library-based test structure layout and testing environment
Author :
Kumar, Madan V. ; Lukaszek, Wes ; Plummer, James D.
Author_Institution :
HPL Inc., Milpitas, CA, USA
Volume :
10
Issue :
3
fYear :
1997
fDate :
8/1/1997 12:00:00 AM
Firstpage :
370
Lastpage :
383
Abstract :
A new test chip design environment, based on commercial tools, containing a test structure advisor and a coupled, library-based layout and testing environment has been developed that dramatically increases productivity. The test structure advisor analyzes cross sections of devices to recommend a comprehensive list of diagnostic and parametric test structures. These test structures can then be retrieved from the libraries of parameterized structures, customized, and placed in a design to rapidly generate customized test chips. Coupling of the layout and test environments enables the automatic generation of the vast majority of the parametric test software. This environment, which has been used to design test chips for a low-power/low-voltage CMOS process, a BiCMOS trench process, and a TFT process, results in an estimated tenfold increase in productivity. In addition, the redesign of five modules of Stanford´s existing BiCMOS test chip, using parameterized test structures, showed an 8× improvement in layout time alone
Keywords :
BiCMOS integrated circuits; automatic testing; fault diagnosis; human resource management; integrated circuit testing; BiCMOS test chip; automatic generation; diagnostic test structures; library-based test structure layout; parameterized structures; parametric test structures; productivity; test structure advisor; testing environment; trench process; Automatic testing; BiCMOS integrated circuits; CMOS process; Chip scale packaging; Design engineering; Documentation; Productivity; Semiconductor device measurement; Software libraries; Software testing;
fLanguage :
English
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
0894-6507
Type :
jour
DOI :
10.1109/66.618210
Filename :
618210
Link To Document :
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