Title :
Enriched Indoor Map Construction Based on Multisensor Fusion Approach for Intelligent Service Robot
Author :
Luo, Ren C. ; Lai, Chun C.
Author_Institution :
Center for Intell. Robot. & Autom. Res., Nat. Taiwan Univ., Taipei, Taiwan
Abstract :
The objective of this paper is to have an intelligent service robot that not only autonomously estimates the environment structure but also simultaneously detects the commonly recognized symbols/signs in the building. The result is an information-enriched map constructed by the environment geometry from a laser ranger and the indoor indicators from visual image. To implement this enriched map, multisensor fusion techniques, i.e., covariance intersection and covariance union, are tactically utilized for robust pose association and sign estimation. Furthermore, an improved alignment technique is applied to promote the mapping precision in a single simultaneous localization and mapping process with the posterior convenience. Additionally, a 2.5-D environment enriched map has been rapidly constructed with the Mesa SwissRanger. We have successfully experimentally demonstrated the proof of concept and summarized it in the conclusion.
Keywords :
SLAM (robots); computational geometry; image fusion; indoor environment; laser ranging; mobile robots; object detection; object recognition; pose estimation; robot vision; service robots; Mesa SwissRanger; SLAM; alignment technique; covariance intersection; covariance union; environment geometry; indoor map construction; information-enriched map construction; intelligent service robot; laser ranger; multisensor fusion techniques; recognized sign detection; recognized symbol detection; robust pose association; sign estimation; simultaneous localization-and-mapping process; Cameras; Estimation; Indexes; Iterative closest point algorithm; Measurement by laser beam; Measurement uncertainty; Robots; Indoor map building; intelligent service robot (ISR); multisensor fusion; simultaneous localization and mapping (SLAM);
Journal_Title :
Industrial Electronics, IEEE Transactions on
DOI :
10.1109/TIE.2011.2141090