DocumentCode
1491950
Title
Low-cost fabrication of optical subassemblies
Author
Cohen, Mitchell S. ; Johnson, Glen W. ; Trewhella, Jean M. ; Lacey, Diane L. ; Oprysko, Modest M. ; Karst, Dennis L. ; DeFoster, Steven M. ; Hogan, William K. ; Peterson, Matthew D. ; Weirick, James A.
Author_Institution
IBM Res., Yorktown Heights, NY, USA
Volume
20
Issue
3
fYear
1997
fDate
8/1/1997 12:00:00 AM
Firstpage
256
Lastpage
263
Abstract
The optical subassembly is a major contributor to the cost of a fiberoptic computer data link. A technology for low-cost fabrication of optical subassemblies is described, with emphasis on a transmitter subassembly designed for fiber-channel standard operation (266 Mb/s for 2 km; 1063 Mb/s for 500 m). A factor of three cost reduction is achieved by limiting the parts count to only three: a laser or receiver chip packaged in a TO-can, a plastic housing, and a plastic aspheric lens; and by employment of a fast, automated active-alignment and subsequent fixing technique. Key enabling features include the use of precision injection molding of specially chosen plastics, an aspheric lens design which permits wide positional variations in the axial direction, and curing of a fast setting epoxy through the use of RF power. A tool was constructed which produced subassemblies at high yield having satisfactory performance
Keywords
data communication; lenses; optical fibre communication; optical links; optical transmitters; plastic packaging; 1063 Mbit/s; 2 km; 266 Mbit/s; 500 m; automated active-alignment; fiber-channel standard operation; fiberoptic computer data link; optical subassemblies; plastic aspheric lens; plastic housing; positional variations; precision injection molding; transmitter subassembly; yield; Costs; Employment; Fiber lasers; Lenses; Optical computing; Optical design; Optical device fabrication; Optical receivers; Optical transmitters; Plastic packaging;
fLanguage
English
Journal_Title
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1070-9894
Type
jour
DOI
10.1109/96.618225
Filename
618225
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