Title :
High density packaging of X-band active array modules
Author :
Hauhe, Mark S. ; Wooldridge, John J.
Author_Institution :
Microwave Div., Hughes Aircraft Co., El Segundo, CA, USA
fDate :
8/1/1997 12:00:00 AM
Abstract :
A new high-density package design has been used to reduce the cost, weight, and size of X-band active array radars. The package used multilayer aluminum nitride (AlN) substrates, flipped monolithic microwave integrated circuit (MMIC) chips, coplanar waveguide transmission lines, and solderless fuzz button interconnects. This paper discusses the design tradeoffs, the package construction and assembly, and test results
Keywords :
MMIC; active antenna arrays; aluminium compounds; coplanar waveguides; flip-chip devices; integrated circuit design; integrated circuit interconnections; integrated circuit packaging; radar receivers; radar transmitters; transceivers; AlN; X-band; active array modules; active array radars; assembly; coplanar waveguide transmission lines; flipped MMIC chips; high-density package design; multilayer substrates; package construction; solderless fuzz button interconnects; Aluminum nitride; Coplanar transmission lines; Coplanar waveguides; Costs; Integrated circuit packaging; MMICs; Microwave integrated circuits; Monolithic integrated circuits; Nonhomogeneous media; Radar;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
