Early analysis of cost/performance trade-offs in MCM systems

Author

Garg, Vivek ; Stogner, Darrell J. ; Ulmer, Craig ; Schimmel, David E. ; Dislis, Chryssa ; Yalamanchili, Sudhakar ; Wills, D. Scott

Author_Institution

Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

Volume

20

Issue

3

fYear

1997

fDate

8/1/1997 12:00:00 AM

Firstpage

308

Lastpage

319

Abstract

This paper explores early analysis of the complex relationships between system architectures and the active and packaging materials from which they are implemented. The goals of this analysis are to enable the designer to specify cost effective technologies for a particular system, and to uncover resources which may be exploited to increase performance of such a system, early in the design process. We describe a prototype tool called IMPACT, which will predict cost, performance, power, and reliability, and present several case studies demonstrating its use

Keywords

cost-benefit analysis; integrated circuit design; integrated circuit packaging; integrated circuit reliability; multichip modules; IMPACT; MCM systems; cost/performance trade-offs; design process; packaging materials; prototype tool; reliability; system architectures; Bandwidth; Chip scale packaging; Circuits; Costs; Helium; Multichip modules; Performance analysis; Power system reliability; Process design; Prototypes;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1070-9894

Type

jour

DOI

10.1109/96.618231

Filename

618231