Title :
Early analysis of cost/performance trade-offs in MCM systems
Author :
Garg, Vivek ; Stogner, Darrell J. ; Ulmer, Craig ; Schimmel, David E. ; Dislis, Chryssa ; Yalamanchili, Sudhakar ; Wills, D. Scott
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fDate :
8/1/1997 12:00:00 AM
Abstract :
This paper explores early analysis of the complex relationships between system architectures and the active and packaging materials from which they are implemented. The goals of this analysis are to enable the designer to specify cost effective technologies for a particular system, and to uncover resources which may be exploited to increase performance of such a system, early in the design process. We describe a prototype tool called IMPACT, which will predict cost, performance, power, and reliability, and present several case studies demonstrating its use
Keywords :
cost-benefit analysis; integrated circuit design; integrated circuit packaging; integrated circuit reliability; multichip modules; IMPACT; MCM systems; cost/performance trade-offs; design process; packaging materials; prototype tool; reliability; system architectures; Bandwidth; Chip scale packaging; Circuits; Costs; Helium; Multichip modules; Performance analysis; Power system reliability; Process design; Prototypes;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
