A new micro-machined millimeter-wave and terahertz snap-together rectangular waveguide technology

Author

Collins, C.E. ; Miles, R.E. ; Digby, J.W. ; Parkhurst, G.M. ; Pollard, R.D. ; Chamberlain, J.M. ; Steenson, D.P. ; Cronin, N.J. ; Davies, S.R. ; Bowen, J.W.

Author_Institution

Inst. of Microwaves & Photon., Leeds Univ., UK

Volume

9

Issue

2

fYear

1999

fDate

2/1/1999 12:00:00 AM

Firstpage

63

Lastpage

65

Abstract

A novel technique for micro-machining millimeter and submillimeter-wave rectangular waveguide components is reported. These are fabricated in two halves which simply snap together, utilizing locating pins and holes, and are physically robust, and cheap, and easy to manufacture. In addition, S-parameter measurements on these structures are reported for the first time and display lower loss than previously reported micro-machined rectangular waveguides

Keywords

S-parameters; losses; micromachining; millimetre wave devices; photolithography; rectangular waveguides; submillimetre wave devices; waveguide components; EHF; MM-wave rectangular waveguide technology; S-parameter measurements; THF; locating holes; locating pins; loss; micro-machined rectangular waveguides; micro-machined waveguide technology; snap-together waveguide technology; submillimeter-wave waveguide components; terahertz waveguide technology; Loss measurement; Manufacturing; Millimeter wave measurements; Millimeter wave technology; Pins; Rectangular waveguides; Robustness; Scattering parameters; Submillimeter wave technology; Waveguide components;

fLanguage

English

Journal_Title

Microwave and Guided Wave Letters, IEEE

Publisher

ieee

ISSN

1051-8207

Type

jour

DOI

10.1109/75.755047

Filename

755047