DocumentCode :
1493127
Title :
Nb edge junction process for submillimeter wave SIS mixers
Author :
Danchi, W.C. ; Sutton, E.C. ; Jaminet, P.A. ; Ono, R.H.
Author_Institution :
Space Sci. Lab., California Univ., Berkeley, CA, USA
Volume :
25
Issue :
2
fYear :
1989
fDate :
3/1/1989 12:00:00 AM
Firstpage :
1064
Lastpage :
1067
Abstract :
The authors describe a junction fabrication process that produces high-quality Nb edge junctions of areas less than 0.2 μm2 on thin quartz (0.10 nm) substrates. This process utilizes a 10:1 projection wafer stepper for high-resolution and high-accuracy layer-to-layer registration. Large numbers of junctions were fabricated reliably with high-quality I-V (current-voltage) characteristics and with impedances suitable for use in SIS (superconductor-insulator-superconductor) mixers for submillimeter astronomy. Junctions produced by this process can be stored on the shelf for more than two years with no special precautions taken, and with an impedance change of less than 10%. No failures have been observed after thermal cycling. Currently these junctions are being used in an astronomical receiver that demonstrates state-of-the-art performance in the atmospheric window centered at 345 GHz. With some improvements to the process, it is possible to make junctions with areas sufficiently small for ωRC≈3 at 800 GHz
Keywords :
mixers (circuits); niobium; solid-state microwave devices; submillimetre astronomy; submillimetre wave devices; superconducting junction devices; type II superconductors; 345 GHz; Nb edge junction process; Nb-SiO2; SIS mixers; SiO2; THF; astronomical receiver; junction fabrication process; projection wafer stepper; quartz substrate; radioastronomy; submillimeter astronomy; submillimeter wave; superconductor-insulator-superconductor; thermal cycling; Electrodes; Fabrication; Lithography; Niobium; Plasma density; Plasma materials processing; Plasma waves; Process design; Substrates; Testing;
fLanguage :
English
Journal_Title :
Magnetics, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9464
Type :
jour
DOI :
10.1109/20.92472
Filename :
92472
Link To Document :
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