DocumentCode :
1493139
Title :
Foreword
Author :
Johnson, R. Wayne
Author_Institution :
Auburn University, AL
Volume :
22
Issue :
1
fYear :
1999
Firstpage :
6
Lastpage :
6
Keywords :
Assembly; Automotive engineering; Bonding; Ceramics; Electronics industry; Electronics packaging; Flip chip; Stress; Substrates; Wire;
fLanguage :
English
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-334X
Type :
jour
DOI :
10.1109/TEPM.1999.755083
Filename :
755083
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1493139
