Title :
Adhesion characterization of no-flow underfills used in flip chip assemblies and correlation with reliability
Author :
Lu, Jicun ; Smith, Brian ; Baldwin, Daniel F.
Author_Institution :
George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fDate :
1/1/2001 12:00:00 AM
Abstract :
Adhesion is one of the key properties of underfills used in flip chip assemblies. This paper characterizes the adhesion strengths of no-flow underfill materials to various die passivations using the shear test techniques. A novel shear test vehicle with planner underfill layers between the die and substrate is presented. The adhesion strengths and failure modes of the no-flow underfill materials during shear testing correlate well with their thermal shock reliability test results. Underfill adhesion related failures such as delamination and crack are investigated and correlated between flip chip assemblies and shear test vehicle assemblies without solder joint interconnects
Keywords :
adhesion; delamination; encapsulation; failure analysis; flip-chip devices; integrated circuit reliability; integrated circuit testing; passivation; shear strength; thermal shock; adhesion characterization; crack; delamination; die passivations; failure modes; flip chip assemblies; no-flow underfills; shear test techniques; shear testing; thermal shock reliability; Adhesives; Assembly; Delamination; Electric shock; Flip chip; Materials reliability; Materials testing; Passivation; Soldering; Vehicles;
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
DOI :
10.1109/6104.924789
