Author :
Singisetti, Uttam ; Wistey, Mark A. ; Burek, Gregory J. ; Baraskar, Ashish K. ; Thibeault, Brian J. ; Gossard, Arthur C. ; Rodwell, Mark J.W. ; Shin, Byungha ; Kim, Eun J. ; McIntyre, Paul C. ; Yu, Bo ; Yuan, Yu ; Wang, Dennis ; Taur, Yuan ; Asbeck, Peter
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of California, Santa Barbara, CA, USA
Abstract :
Abstract-We report Al2O3Zln0.53Ga0.47As MOSFETs having both self-aligned in situ Mo source/drain ohmic contacts and self-aligned InAs source/drain n+ regions formed by MBE regrowth. The device epitaxial dimensions are small, as is required for 22-nm gate length MOSFETs; a 5-nm In0.53Ga0.47As channel with an In0.4sAl0.52As back confinement layer and the n++ source/drain junctions do not extend below the 5-nm channel. A device with 200-nm gate length showed ID = 0.95 mA/mum current density at VGS = 4.0 V and gm = 0.45 mS/mum peak transconductance at VDS = 2.0 V.
Keywords :
MOSFET; indium compounds; In0.53Ga0.47As channel MOSFET; InGaAs; MEE regrowth; back confinement layer; device epitaxial dimension; self-aligned InAs source/drain; source/drain junction; source/drain ohmic contacts; III–V MOSFET; InAs source/drain; InGaAs MOSFET; migration-enhanced epitaxial regrowth; source/drain regrowth;