DocumentCode :
1493805
Title :
On extending slicing floorplan to handle L/T-shaped modules and abutment constraints
Author :
Young, F.Y. ; Wong, M.D.F. ; Yang, Hannah H.
Author_Institution :
Dept. of Comput. Sci. & Eng., Chinese Univ. of Hong Kong, Shatin, Hong Kong
Volume :
20
Issue :
6
fYear :
2001
fDate :
6/1/2001 12:00:00 AM
Firstpage :
800
Lastpage :
807
Abstract :
In floorplanning, it is common that a designer wants to have certain modules abutting with one another in the final packing. The problem of controlling the relative positions of an arbitrary number of modules in floorplan design is nontrivial. Slicing floorplan has an advantageous feature in which the topological structure of the packing can be found without knowing the module dimensions. This feature is good for handling placement constraints in general. In this paper, we make use of it to solve the abutment problem in the presence of L- and T-shaped modules. This is done by a procedure which explores the topological structure of the packing and finds the neighborhood relationship between every pair of modules in linear time. Our main contribution is a method that can handle abutment constraints in the presence of L- or T-shaped modules in such a way that the shape flexibility of the soft modules can still be fully exploited to obtain a tight packing. We tested our floorplanner with some benchmark data and the results are promising
Keywords :
VLSI; circuit layout CAD; integrated circuit layout; L-shaped modules; T-shaped modules; VLSI layout; abutment constraints; floorplanning; neighborhood relationship; placement constraints; slicing floorplan; tight packing; topological structure; Benchmark testing; Circuit optimization; Circuit testing; Components, packaging, and manufacturing technology; Constraint optimization; Cost function; Design optimization; Integrated circuit interconnections; Shape; Very large scale integration;
fLanguage :
English
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
0278-0070
Type :
jour
DOI :
10.1109/43.924833
Filename :
924833
Link To Document :
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