Title :
Emulsion, foams, and thin films [Book Review]
Author :
Shea, John ; Schoch, K.F.
Keywords :
Assembly; Book reviews; Design engineering; Electronic packaging thermal management; Electronics packaging; Kinetic theory; Polymer films; Silicon compounds; Suspensions; Transistors;
Journal_Title :
Electrical Insulation Magazine, IEEE
DOI :
10.1109/MEI.2001.925309
