• DocumentCode
    1495369
  • Title

    Packaging impact on switching noise in high-speed digital systems

  • Author

    Gong, S. ; Hentzell, H. ; Persson, S.T. ; Hesselbom, H. ; Lofstedt, B. ; Hansen, M.

  • Author_Institution
    Ind. Microelectron. Centre, Linkoping, Sweden
  • Volume
    145
  • Issue
    6
  • fYear
    1998
  • Firstpage
    446
  • Lastpage
    452
  • Abstract
    Owing to the ever-increasing clock frequency in digital circuits and systems, simultaneous switching noise (SSN), caused by fast rise/fall pulse edges in combination with parasitic inductance in the power supply distribution network, is becoming a severe problem in many high-speed digital system designs. It is quantitatively shown that the influence of SSN, which is negligible when the rise/fall time is long (>5 ns), becomes a critical factor, limiting system performance in the subnanosecond rise time region. Based on theoretical analyses and computational simulations in respect to various packaging techniques, technical solutions and design guidelines for reducing SSN are summarised.
  • Keywords
    integrated circuit packaging; clock frequency; computational simulations; design guidelines; high-speed digital systems; packaging; parasitic inductance; power supply distribution network; pulse edges; simultaneous switching noise; system performance;
  • fLanguage
    English
  • Journal_Title
    Circuits, Devices and Systems, IEE Proceedings
  • Publisher
    iet
  • ISSN
    1350-2409
  • Type

    jour

  • DOI
    10.1049/ip-cds:19982394
  • Filename
    756345