DocumentCode :
1495369
Title :
Packaging impact on switching noise in high-speed digital systems
Author :
Gong, S. ; Hentzell, H. ; Persson, S.T. ; Hesselbom, H. ; Lofstedt, B. ; Hansen, M.
Author_Institution :
Ind. Microelectron. Centre, Linkoping, Sweden
Volume :
145
Issue :
6
fYear :
1998
Firstpage :
446
Lastpage :
452
Abstract :
Owing to the ever-increasing clock frequency in digital circuits and systems, simultaneous switching noise (SSN), caused by fast rise/fall pulse edges in combination with parasitic inductance in the power supply distribution network, is becoming a severe problem in many high-speed digital system designs. It is quantitatively shown that the influence of SSN, which is negligible when the rise/fall time is long (>5 ns), becomes a critical factor, limiting system performance in the subnanosecond rise time region. Based on theoretical analyses and computational simulations in respect to various packaging techniques, technical solutions and design guidelines for reducing SSN are summarised.
Keywords :
integrated circuit packaging; clock frequency; computational simulations; design guidelines; high-speed digital systems; packaging; parasitic inductance; power supply distribution network; pulse edges; simultaneous switching noise; system performance;
fLanguage :
English
Journal_Title :
Circuits, Devices and Systems, IEE Proceedings
Publisher :
iet
ISSN :
1350-2409
Type :
jour
DOI :
10.1049/ip-cds:19982394
Filename :
756345
Link To Document :
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