DocumentCode
1495890
Title
Process capability of local oxidation of silicon isolation technology for sub-half micrometre custom IC applications
Author
Song, J.
Author_Institution
Dept. of Electron. Eng., Changwon Nat. Univ., Kyungnam, South Korea
Volume
35
Issue
6
fYear
1999
fDate
3/18/1999 12:00:00 AM
Firstpage
505
Lastpage
506
Abstract
The process capability of conventional LOCOS isolation for sub-half micrometre custom IC applications is investigated in terms of field oxide thinning and bird´s beak encroachment. A 0.4 μm isolation space appears to be the practical limit when the appropriate film thickness combination is used
Keywords
application specific integrated circuits; isolation technology; oxidation; silicon; 0.4 micron; LOCOS isolation; Si; bird beak encroachment; field oxide thinning; isolation technology; local oxidation; process capability; sub-half micron custom IC applications;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el:19990350
Filename
756423
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