DocumentCode
1496349
Title
Experimental Demonstration of the High-Performance Floating-Body/Gate DRAM Cell for Embedded Memories
Author
Wu, Qingqing ; Chen, Jing ; Lu, Zhichao ; Zhou, Zhenming ; Luo, Jiexin ; Chai, Zhan ; Yu, Tao ; Qiu, Chao ; Li, Le ; Pang, Albert ; Wang, Xi ; Fossum, Jerry G.
Author_Institution
State Key Lab. of Functional Mater. for Inf., Shanghai Inst. of Microsyst. & Inf. Technol., Shanghai, China
Volume
33
Issue
6
fYear
2012
fDate
6/1/2012 12:00:00 AM
Firstpage
743
Lastpage
745
Abstract
A capacitorless DRAM cell, floating-body/gate cell (FBGC), is experimentally presented with planar partially depleted SOI CMOS technology. The specially designed gate/drain underlap and gate/source overlap of the first transistor enable long worst case retention time as well as the fast write speed. The operation power dissipation is dramatically reduced while maintaining high sense margin. In addition, FBGC demonstrates excellent endurance performance and nondestructive read operation.
Keywords
CMOS integrated circuits; DRAM chips; embedded systems; silicon-on-insulator; embedded memories; gate drain underlap; gate source overlap; high performance floating body gate DRAM cell; nondestructive read operation; partially depleted SOI CMOS technology; power dissipation; retention time; silicon-on-insulator; write speed; CMOS technology; Current measurement; Logic gates; Random access memory; Reliability; Transistors; Capacitorless DRAM; SOI floating-body cell (FBC); overlap; tunneling field-effect transistor (T-FET); underlap;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2012.2190031
Filename
6184278
Link To Document